In the name of Allah the Merciful

Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

by Sandip Bhattacharya, J Ajayan, Fernando Avila Herrera, B0CNBH4B7N, 1032363819, 1003817092, 1032363827, 9781032363820, 9781003817093, 9781032363813, 978-1032363820, 978-1003817093, 978-1032363813

10 $

English | 2024 | Original PDF

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Aggressive  scaling of device and interconnect dimensions has resulted in many  low-dimensional issues in the nanometer regime. This book deals with  various new-generation interconnect materials and interconnect modeling,  and highlights the significance of novel nano-interconnect materials  for 3D integrated circuit design. It provides information about advanced  nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR)  for the realization of interconnects, interconnect models, and crosstalk  noise analysis. 

Features: 

•  Focuses on materials and nanomaterials utilization in next-generation  interconnects based on carbon nanotubes (CNT) and graphene nanoribbons  (GNR). 

• Helps readers realize interconnects,  interconnect models, and crosstalk noise analysis. • Describes hybrid  CNT- and GNR-based interconnects. 

• Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. 

• Overviews pertinent RF performance and stability analysis. 

This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.